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204 Pin Unbuffered Ruggedized SO-DIMM, Non ECC
Two holes at the top of this module allow it to be mounted to the main board for a secure fit.
Extended Temp.
| AMP Inc. Part Number | Density | Height(in) | Module Config. | Device Type | Rank | Description |
|---|---|---|---|---|---|---|
| AMP256TSU28AFB0P-TYY | 2GB | 1.34 | 256MX64 | 256MX8 | 1 | Unbuffered RgSO-DIMM™, non ECC |
| AMP512TSU48AFB0P-TYY | 4GB | 1.34 | 512MX8 | 512MX8 | 1 | Unbuffered RgSO-DIMM™, non ECC |
| AMP1K0TSU48A2B0P-TYY | 8GB | 1.34 | 512MX8 | 512MX8 | 1 | Unbuffered RgSO-DIMM™, non ECC |
| T= 0°C ≤ TA≤+85°C | YY : Speed Bin, 86 = 800 CL6, 07 = 1066 CL7, 39 = 1333 CL9 |
Commercial Temp.
| AMP Inc. Part Number | Density | Height(in) | Module Config. | Device Type | Rank | Description |
|---|---|---|---|---|---|---|
| AMP256TSU28AFB0P-CYY | 2GB | 1.34 | 256MX64 | 256MX8 | 1 | Unbuffered RgSO-DIMM™, non ECC |
| AMP512TSU48AFB0P-CYY | 4GB | 1.34 | 512MX64 | 512MX8 | 1 | Unbuffered RgSO-DIMM™, non ECC |
| AMP1K0TSU48A2B0P-CYY | 8GB | 1.34 | 1GX64 | 512MX8 | 1 | Unbuffered RgSO-DIMM™, non ECC |
| C= 0°C to 70°C | YY : Speed Bin, 86 = 800 CL6, 07 = 1066 CL7, 39 = 1333 CL9 |
Industrial Temp.
| AMP Inc. Part Number | Density | Height(in) | Module Config. | Device Type | Rank | Description |
|---|---|---|---|---|---|---|
| AMP256TSU28AFB0P-RYY | 2GB | 1.34 | 256MX64 | 256MX8 | 1 | Unbuffered RgSO-DIMM™, non ECC |
| AMP512TSU48AFB0P-RYY | 4GB | 1.34 | 512MX64 | 512MX8 | 1 | Unbuffered RgSO-DIMM™, non ECC |
| AMP1K0TSU48A2B0P-RYY | 8GB | 1.34 | 1GX64 | 512MX8 | 1 | Unbuffered RgSO-DIMM™, non ECC |
| R= -40°C to +85°C | YY : Speed Bin, 86 = 800 CL6, 07 = 1066 CL7, 39 = 1333 CL9 |
1317 E. Edinger Avenue, Santa Ana, CA 92705, USA | 714.460.9800 | sales@ampinc.biz | © 2012 All Rights Reserved
Quality Management Systems ISO 9001 - 2008
Environment Managed ISO 14001 - 2004
Quality Management Systems ISO 9001 - 2008Environment Managed ISO 14001 - 2004