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| C = Commercial Temperature
I = Industrial Temperature
M = Commercial NAND tested to -20°C to +85°C
Y = Factory options, contact amp inc. sales@ampinc.biz for details. | |
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| HOST INTERFACE |
Supports Dual Host interface: SATA 2.6 Compliant, 3Gb/s and 1.5G/bs support.
Native Command Queuing (up to 32 commands).
SMART Command Transport.
On chip hardware 8 bit BCH-ECC engines can correct up to 8 bit errors per 512 byte data.
Supports command package auto-write.
Supports legacy and native command queuing.
BGA solder interface or connectorizes options available.
Supports SMART Function. |
| FLASH INTERFACE AND MEMORY SUPPORT |
Supports up to 16 channel and 16 chip enable pins per channel.
SLC/MLC NAND type flash.
2K and 4K bytes per page architecture.
Supports EDO mode.
Supports external bus switch to reduce bus loading.
Whole Drive Dynamic Wear Leveling.
Data integrity under power-cycling. |
| CONTROLLER CORE |
Built in 1.8V POR (Power On Restart).
Supports firmware ISP, Firmware upgraded. |
| HIGH PERFORMANCE |
Sequential Reader Transfer: 260MB/s (@128K blocks).
Sequential Write Transfer: 250MB/s (@128K blocks).
Random Read & Write IOPS: 30,000 (@4K blocks). |
| POWER CONSUMPTION |
| Controller operations current less than 950mWSleep: 50mW. |
| TEMPERATURE RANGE |
Industrial -40 Degrees to 85 Degrees Celcius.
Commercial 0 Degrees to 70 Degrees Celcius. |
| PHYSICAL DIMENSIONS |
| 31mm x 64mm with capacity and height configurations as listed below: |
CONNECTORIZED
2 level - 9.5mm
3 level - 12.5mm
4 level - 15.5mm
5 level - 18.5mm |
BGA
2 level - 6.5mm
3 level - 9.5mm
4 level - 12.5mm
5 level - 15.5mmv |